LED Encapsulation Materials for General Lighting

Product Description

Good adhesion to metals, chips and other substrates

Good sulfur resistance and thermal shock performance

Translucent appearance

Applications

● Encapsulation for LED lighting components

● Encapsulation for LED backlight components

● Encapsulation for Auto LED lighting components

It is a kind of two-part, high temperature cure silicone resin, which is designed for SMD LED encapsulation and suitable for protection of chips and gold wire. The typical features are translucent appearance, good light transmission, sulfur resistance, excellent thermal shock performance, and good adhesion to frame and silver-plated coatings.

Specifications

Properties	8103	8105	7097S	8232	7098	8225	8136	8228	5004	5005S	8157	7136
Mix ratio	1:10	1:10	1:10	1:10	1:10	1:10	1:10	1:10	1:4	1:4	1:1	1:10
Viscosity	5200	4000	4600	4000	5300	3500	4300	4500	4000	4200	3600	4000
Refractive Index	1.55	1.54	1.55	1.54	1.54	1.52	1.54	1.50	1.54	1.54	1.41	1.41
Cure Condition	100℃1hr, 150℃3hr	100℃1hr, 150℃3hr	100℃1hr, 150℃3hr	100℃1hr, 150℃3hr	100℃1hr, 150℃3hr	100℃1hr, 150℃3hr	100℃1hr, 150℃3hr	100℃1hr, 150℃3hr	100℃1hr, 150℃3hr	100℃1hr, 150℃3hr	100℃1hr, 150℃3hr	100℃1hr, 150℃3hr
Shore Hardness	D74	D62	D66	D62	D62	D65	D49	D45	A78	A75	A70	A55
Tensile Strength Mpa	12.5	11.0	7.0	11.0	6.5	7.0	3.0	3.0	2.0	2.5	6.5

LED encapsulation materials are specialized compounds used to encapsulate LED chips, providing protection from moisture, dust, and mechanical damage. These materials also enhance the optical performance of LEDs by improving light output and color stability. Common types of encapsulation materials include optical encapsulants and silicone materials for led, such as epoxy resins, silicone, and polyurethane. Choosing the right material can have a significant impact on the performance and durability of your LED products.